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ledtech electronics corp . nanya road,mugang zhaoqing city guangdong china. tel:86-758-2875541,2870651,2877464,2876185,2877017 fax:86-758-2878014 http://www.ledtech.com.tw specification part no. : la(c) 5641-11 ewrn 0.56"(14.22mm)single digit display approved by checked by prepared by tung andy feng
la(c)5641-11 0.56" single digit display ver.: 01 date: 2007/01/18 page: 1 /5 dimensions 19.05 1.68 dia 8 1.4 14.22 2.54 x 4=10.16 3.5 min 15.24 0.5 dia 12.4 8.0 8.13 mark notes: 1. the slope angle of any pin may be 5.0 max. 2. all dimensions are in mm, tolerance is 0.25mm unless otherwise noted. internal circuit diagram LA5641-11 lc5641-11 a 3,8 7 b 6 c 4 d 2 e 1 f 9 g 10 dp 5 a b c d e f g dp 3,8 7 6421910 5 pin. pin. pin. pin.
la(c)5641-11 0.56" single digit display ver.: 01 date: 2007/01/18 page: 2 /5 description led chip face color part no. material emitting color surface segments LA5641-11 ewrn gaasp/gap orange grey white lc5641-11 ewrn gaasp/gap orange grey white absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation per segment p d 78 mw pulse current(1/10duty cycle,0.1ms pulse width.) per chip i fp 100 ma forward current per chip i f 30 ma reverse (leakage)current per chip ir 100 ua reverse voltage per chip v r 5 v operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
soldering temperature. tsol. dip soldering: 260
for 5 sec. hand soldering: 350
for 3 sec.
la(c)5641-11 0.56" single digit display ver.: 01 date: 2007/01/18 page: 3 /5 electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity per segment i v if=10ma/seg. 1.15 3.3 mcd forward voltage vf if=20ma/seg. 2.1 2.6 v peak wavelength p if=20ma/seg. 635 nm dominant wavelength d if=20ma/seg. 626 nm reverse current per chip (leakage current per chip) ir vr=5v 100 a spectrum line halfwidth ? if=20ma/seg. 35 nm response time t ----------- 250 ns note: customer?s special requirements are also welcome.
la(c)5641-11 0.56" single digit display ver.: 01 date: 2007/01/18 page: 4 /5 typical electrical/optical characteristic curves (25
ambient temperature un less otherwise noted) fig.1 relative intensity vs. wavelength wavelength (nm) relative intensity 0.5 1.0 635 705 775 565 1 0 0 h z fig.2 maximum tolerable peak current vs. pulse duration ratio of maximum operating peak current to temperature derated dc current 1 1 10 100 3 k h z 10 1 0 k h z 1 k h z 1000 3 0 0 h z 100 10000 operation in this region reouires temperature derating of i dc maximum tp - pulse duration - ? s i f peak i dc max forward current if(ma) forward voltage vf(v) fig .3 forward current vs. forward voltage per chip 1.6 10 2.0 1.8 2.2 2.4 2.6 20 40 50 30 20 forward current if(ma) ambient temperature ta (c) fig.4 forward current vs. derating curve 0204060 100 80 30 40 10 50 fig.5 relative luminous intensity vs. forward current relative luminous intensity 4.0 normalized at 10ma 6.0 8.0 forward current (ma) 10 10 2.0 0 20 30 40 30 ambient temperature ta (c) fig.6 luminous intensity vs. ambient temperature relative luminous intensity -30 0.1 0.5 0.2 1.0 0 -20 -10 10 20 2.0 60 40 50 70
la(c)5641-11 0.56" single digit display ver.: 01 date: 2007/01/18 page: 5 /5 precautions in use: please pay special attntion to the next point to incorporate opto device to high reliability 1. do not bend the lead. bending leads could cause breakage of leads or the degradation of the chip. when bending is unavoidable, strictly follow the cautionary instruction below. (1)bend the leads before soldering. (2)bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) the lead bending point must be more th an 1.6mm away from the edge or the resin part. (4)when a pin is tested for its endurance, bending degree should be boe repeated no more than two times. 2. setting a product by using tool such as a holder should be avoided. when necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. the hole pitch of a circuit board must fit into the lead pitch of products. 4. when soldering, care the followings: (1)do not heat a product under an y stress (i.e.: twist) to leads. (2)do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 the lead bending point must be more than 1.6mm away from the edge or the resin part. (4)soldering with pc board should be conducted with following conditions. (a) for dip soldering pre-heating : 90
max. for within 60 sec. soldering max. : 260 ? 5
(solder temp.) for within 5 sec. (b) solderi ng iron : 350
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max. cleaning time : 30sec. max. 6. minimum amount of soldering flux should be used. soldering flux should be applied only to the pin portion. 7. the following may damage products or led chips: a ttachment or contact of residual flux solvent onto the product surface or to led ch ips, or invasion of the same into the product.

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